The PCB’s for Prototype #2 arrived yesterday from Seeed.
Quality on the PCB’s is about the same as the last prototype. The stencil, on the other hand, sucked. It has significant warps - mostly in the top side area. It is very difficult to photograph the warps, but you can get the idea by looking at the waves in the reflections. At their worst, they lift almost 2mm above the base plane.
I gave it a go for the bottom side, and it worked out OK.
The most crucial registration is on the NX3DV642 MIPI switch for the cameras. That little sucker is only 2.5mm x 3.4mm with a 0.4mm pin pitch. As you can see, the stencil worked pretty well (and my hands were pretty steady, too!):
Bottom side is fired, and looking good. I’m going to tackle the top side tomorrow.